S16MD01/S16MD02/S26MD01/S26MD02
Fig.11 Turn-on Time vs. Forward Current
(S16MD02/S26MD02 )
20
V
D
= 6V
R
L
= 100Ω
T
a
= 25˚C
10
Zero-cross voltage V
OX
( V )
Turn-on time t
on
(
µ
s )
Fig.12 Zero-cross Voltage vs.
Ambient Temperature
(S16MD02/S26MD02 )
Load : R
I
F
= 15mA
25
5
4
3
20
2
10
20
30
40 50
Forward current I
F
( mA )
100
15
- 30
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
s
Basic Operation Circuit
R
1
+
V
CC
D
1
3
V
I
Tr1
Z
S
:
Surge absorption circuit
2
SSR
6
8
Z
S
Load
AC 100V (
S16MD01/S16MD02
)
AC 200V (
S26MD01/S26MD02
)
( 1 ) DC Drive
AC supply voltage
Input signal
Load current
( for resistance load)
( 2 ) Pulse Drive
( 3 ) Phase Control
Notes 1 ) If large amount of surge is loaded onto V
CC
or the driver circuit, add a diode D
1
between terminal 2
and 3 to prevent reverse bias from being applied to the infrared LED.
2 ) Be sure to install a surge absorption circuit.
An appropriate circuit must be chosen according to the load ( for CR, choose its constant ) . This must be
carefully done especially for an inductive load.
) For phase control, adjust such that the load current immediately after the input signal is applied will be
3
more than 30mA.
s
Precautions for Use
1 ) All pins must be soldered since they are also used as heat sinks ( heat radiation fins) . In
designing, consider the heat radiation from the mounted SSR.
2 ) For higher radiation efficiency that allows wider thermal margin, secure a wider round
pattern for Pin No.8 when designing mounting pattern. The rounded part of Pin No.5 ( gate )
must be as small as possible. Pulling the gate pattern around increases the change of being
affected by external noise.
3 ) As for other general cautions, refer to the chapter“Precautions for Use”
SHARP [ SHARP ELECTRIONIC COMPONENTS ]
