S112S01 Series/S116S01 Series
Fig. 1 RMS ON-state Current vs. Ambient
( S112S01Series)
Temperature
12
10
8
6
4
(5)
2
0
- 25
(4)
(3) (2)
(1)
Fig. 2 RMS ON-state Current vs. Ambient
( S116S01Series)
Temperature
18
RMS On-state current I
T
( Arms )
16
14
12
10
8
6
4
2
(5)
(4)
(3) (2)
(1)
RMS ON-state current I
T
( Arms )
0
25
50
75
100
Ambient temperature T
a
( ˚C )
125
0
- 25
0
25
50
75
100
Ambient temperature T
a
( ˚C )
125
( 1)
( 2)
( 3)
( 4)
( 5)
With infinite heat sink
With heat sink ( 280 x 280 x 2 mm Al plate )
With heat sink ( 200 x 200 x 2 mm Al plate )
With heat sink ( 100 x 100 x 2 mm Al plate )
Without heat sink
( 1)
( 2)
( 3)
( 4)
( 5)
With infinite heat sink
With heat sink ( 280 x 280 x 2 mm Al plate )
With heat sink ( 200 x 200 x 2 mm Al plate )
With heat sink ( 100 x 100 x 2 mm Al plate )
Without heat sink
( Note ) With the Al heat sink set up vertically,tighten the device at the center of the Al heat sink with a torque
of 0.4N • m and apply thermal conductive silicone grease on the heat sink mounting plate. Forcible cooling
shall not be carried out.
Fig. 3 RMS ON-state Current vs.
Case Temperature
16
S116S01Series
14
RMS On-state current I
T
( Arms )
Fig. 4 Forward Current vs.
Ambient Temperature
60
50
S112S01Series
Forward current I
F
( mA )
12
10
8
6
4
2
0
- 25
40
30
20
10
0
25
50
75
100
Case temperature T
c
( ˚C )
125
0
- 25
0
25
50
75
100
Ambient temperature T
a
( ˚C )
125
SHARP [ SHARP ELECTRIONIC COMPONENTS ]
