C8051F80x-83x
4. QFN-20 Package Specifications
Figure 4.1. QFN-20 Package Drawing
Table 4.1. QFN-20 Package Dimensions
Dimension
A
A1
b
D
D2
e
E
E2
Min
0.80
0.00
0.18
2.00
Typ
0.90
0.02
0.25
4.00 BSC.
2.15
0.50 BSC.
4.00 BSC.
2.15
Max
1.00
0.05
0.30
2.25
Dimension
L
L1
aaa
bbb
ddd
eee
Z
Y
Min
0.45
0.00
—
—
—
—
—
—
Typ
0.55
—
—
—
—
—
0.43
0.18
Max
0.65
0.15
0.15
0.10
0.05
0.08
—
—
2.00
2.25
Notes:
1.
All dimensions shown are in millimeters (mm) unless otherwise noted.
2.
Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3.
This drawing conforms to the JEDEC Solid State Outline MO-220, variation VGGD except for
custom features D2, E2, Z, Y, and L which are toleranced per supplier designation.
4.
Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
Rev. 1.0
33
SILABS [ SILICON LABORATORIES ]
