Si2704/05/06/07-A10
1. Electrical Specifications
Table 1. Recommended Operating Conditions
1
Parameter
Power Output Supply Voltage
Main Supply Voltage
Interface (I/O) Supply Voltage
Load Impedance
Ambient Temperature
Junction Temperature
Case Delta from Junction
Delta from Junction to Ambient
3
Symbol
V
PP
V
DD
V
IO
R
L
T
A
T
J
JC
JA
Temperature delta between junc-
tion and top center of package
QFN package
eTQFP
Test Condition
Min
4.0
2
2.7
1.62
—
–20
—
—
—
—
Typ
—
3.3
—
3–8
25
—
—
25
30
Max
6.6
3.6
3.6
—
85
135
5
—
—
Unit
V
V
V
Ω
°C
°C
°C/W
°C/W
°C/W
Notes:
1.
All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at V
DD
= 3.3 V and 25 °C unless otherwise stated. Parameters are tested in production unless
otherwise stated.
2.
Operation with V
PP
as low as 3 V is possible at reduced performance.
3.
The
JA
is layout-dependent; therefore, PCB layout must provide adequate heat-sink capability. The.
JA
is specified,
assuming adequate ground plane as in “AN470: 270x Layout Guidelines.”
Table 2. Absolute Maximum Ratings
1
Parameter
Power Output Supply Voltage
Main Supply Voltage
Interface (I/O) Supply Voltage
Input Current
2
Input Voltage
2
Operating Temperature
Junction Temperature
Storage Temperature
Symbol
V
PP
V
DD
V
IO
I
IN
V
IN
T
A
T
J
T
A
Value
–0.5 to 7.0
–0.5 to 3.9
–0.5 to 3.9
10
–0.3 to (V
IO
+ 0.3)
–20 to +85
150
–55 to +150
Unit
V
V
V
mA
V
°C
°C
°C
Notes:
1.
Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation
should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure beyond
recommended operating conditions for extended periods may affect device reliability.
2.
For input pins SCLK, SDIO, DCLK, DFS, DIN, RST, OUTSEL, MFPx.
Rev. 0.6
5
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