SA7267
This is a rather large heat sink and may not be practical in some applications. If a smaller heat sink is required
for reasons of size or cost, the heat sink can be isolated from the chassis so the mica washer is not needed. This
will change the required heat sink to a 1.1°C /W unit if the case-to-heat-sink interface is lubricated.
The thermal requirements can become more difficult when an amplifier is driving a reactive load. For a given
magnitude of load impedance, a higher degree of reactance will cause a higher level of power dissipation within
the amplifier. As a general rule, the power dissipation of an amplifier driving a 60º reactive load (usually
considered to be a worst-case loudspeaker load) will be roughly that of the same amplifier driving the resistive
part of that load. For example, a loudspeaker may at some frequency have impedance with a magnitude of 8Ω
and a phase angle of 60º. The real part of this load will then be 4Ω, and the amplifier power dissipation will
roughly follow the curve of power dissipation with a 4Ω resistor.
TYPICAL APPLICATION CIRCUIT IN SPLIT SUPPLY
Note: Figures for the SA7267.
HANGZHOU SILAN MICROELECTRONICS CO.,LTD
Http: www.silan.com.cn
REV:1.1
2006.05.25
Page 5 of 11
SILAN [ SILAN MICROELECTRONICS JOINT-STOCK ]
