BSS138
GENERAL FEATURES
●
V
DS
= 50V,I
D
= 0.22A
R
DS(ON)
< 6Ω @ V
GS
=4.5V
R
DS(ON)
< 3.5Ω @ V
GS
=10V
ESD Rating：1000V HBM
●
High Power and current handing capability
●
Lead free product is acquired
●
Surface Mount Package
Schematic diagram
APPLICATION
●Direct
Logic-Level Interface: TTL/CMOS
●Drivers:
Relays, Solenoids, Lamps,
Hammers,Display, Memories, Transistors, etc.
●Battery
Operated Systems
●Solid-State
Relays
Marking and pin Assignment
SOT-23 top view
PACKAGE MARKING AND ORDERING INFORMATION
Device Marking
Device
Device Package
Reel Size
BSS138
BSS138
SOT-23
Ø180mm
Tape width
8 mm
Quantity
3000 units
ABSOLUTE MAXIMUM RATINGS(TA=25℃unless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
Gate-Source Voltage
Drain Current-Continuous@ Current-Pulsed (Note 1)
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Limit
50
±20
0.22
0.88
0.36
-55 To 150
Unit
V
V
A
A
W
℃
V
DS
V
GS
I
D
I
DM
P
D
T
J
,T
STG
THERMAL CHARACTERISTICS
Thermal Resistance,Junction-to-Ambient (Note 2)
R
θJA
350
℃
/W
ELECTRICAL CHARACTERISTICS (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BV
DSS
V
GS
=0V I
D
=250μA
Min
50
Typ
Max
Unit
V
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1
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