Preliminary
CGB-1089Z 50-1000 MHz Cascadable MMIC Amplifier
Application Schematic
Vs
1uF
1200pF
Application Circuit Element Values
Reference
Designator
Frequency (MHz)
50 to 1000
C
B1
C
B2
4
1
RF in
75
Ω
Cb1
2
CGB-1089
1200pF
220pF
1.5uH LS Coilcraft
2.7nH Toko
Lc
3
RF out
Ls
Cb2
75
Ω
L
C
L
S
Evaluation Board Layout
Mounting Instructions
1uF
1200pF
1. Solder the copper pad on the backside of the device package to
the ground plane.
2. Use a large ground pad area with many plated through-holes as
shown.
3. We recommend 1 or 2 ounce copper. Measurement for this
datasheet were made on a 60 mil thick GTEK board with 1
ounce copper on both sides.
Q1
Lc
Cb1
Ls
Cb2
+
Part Number Ordering Information
Pin Description
Part Number
Reel Size
Devices / Reel
Pin #
Function
RF IN
Description
RF input pin. This pin requires the use of
an external DC blocking capacitor chosen
for the frequency of operation.
Connection to ground. Use via holes for
best performance to reduce lead
inductance as close to ground leads as
possible
RF output and bias pin. DC voltage is
present on this pin, therefore a DC
blocking capacitor is necessary for proper
operation.
Phone: (800) SMI-MMIC
5
CGB-1089Z
7"
1000
1
Package Marking
4
2, 4
GND
GB1Z
2
1
2
3
RF OUT/
BIAS
303 S. Technology Ct.
Broomfield, CO 80021
1
3
3
http://www.sirenza.com
EDS-104857 Rev A
SIRENZA [ SIRENZA MICRODEVICES ]
