DATA SHEET • CLA SERIES DIODES
50
Ω
Connector
0.020 in.
Typ.
0.001 in. Gold Wire
Bond, Typical
Ground
Solder or
Plane Epoxy Die Bond
Microstrip Board
TFG 0.006 in. Thick, Typical
Figure 6. Diodes in 50
Ω
Microstrip Circuit (Side View)
Diode, Typical
TFG Board
Ground
Return
X1
X2
50
Ω
Conductor
0.022 in., Typical
Figure 7. Diodes in 50
Ω
Microstrip Circuit (Top View)
Coil for Ground Return
X1
X2
C
J
R
P
C
J
R
P
50
Ω
C
J
R
R
50
Ω
Figure 8. Low-Level Equivalent Circuit
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
6
September 28, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200100I
SKYWORKS [ SKYWORKS SOLUTIONS INC. ]
