DATA SHEET • CLA SERIES DIODES
Package Outline Drawings
Package outline die drawings for the CLA diode series are shown
in Figures 12, 13, and 14. Hermetic package outlines are shown
in Figures 15 through 18.
Die Packages
Schematic
1
Anode
Top Contact, Gold
0.002 (0.050 mm)
Dia. Min.
2
0.014 ± 0.001
(0.325 ± 0.025 mm)
0.014 ± 0.001
(0.325 ± 0.025 mm)
0.004 (0.010 mm)
0.006 (0.015 mm) Nom.
1
Cathode Metallized Back
Contact, Gold
2
S1565
Figure 12. 149-815 Package
Schematic
Anode
Metallized
Gold Dot
0.010 (0.251 mm) Min.
0.014 (0.356 mm) Max. Sq.
1
2
150-801:
0.002 (0.051 mm) Min.
150-806:
0.0011 (0.028 mm) Nom.
1
0.004 (0.127 mm) Min.
0.006 (0.152 mm) Max.
Silicon
2
Cathode Metallized Back
Contact: Gold
S1567
Figure 13. 150 Series Package
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
8
September 28, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200100I
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