RM914
Package Dimensions and Pin Descriptions
Power Amplifier Module for AMPS Applications (824–849 MHz)
Package Dimensions and Pin Descriptions
The RM914 is a multi-layer laminate base, overmold encapsulated modular package designed for
surface mount solder attachment to a printed circuit board. Figure 12 is a mechanical drawing of
the pad layout for this package and Figure 13 illustrates typical case markings. The pin numbering
convention starts with pin 1 in the upper left, as indicated in Figure 12, and increments
counter-clockwise around the package. Table 5 describes each pin function.
Figure 12. RM914 Package Drawing
PIN 1
PIN 2
PIN 3
PIN 6
PIN 5
PIN 4
5.92/6.15
5.92/6.15
1.500 TYP
TOP VIEW
SIDE VIEW
2.870 (2x)
2.870 (4x)
1.981 (2x)
1.854 (6x)
1.219 (2x)
1.245 (2x)
2.006 (4X)
PIN 7
2.500
(4x)
2.500
(4x)
1.016
.762 6x
(PIN 1)
COPPER
BOTTOM
SOLDER MASK
BOTTOM
R .500 TYP
100637_002
100637D
March 22, 2002
Skyworks
11
SKYWORKS [ SKYWORKS SOLUTIONS INC. ]
