DATA SHEET • SKY65233-11
Recommended Footprint
10.34 mm
Pin 47
0.425 mm
24X 0.5 mm
24X 0.75 mm
Solder Mask
10.44 mm
Pin 48
0.20 X 45
48X 0.85 mm
48X 0.6 mm
0.425 mm
Pin 1
0.175 mm
Typ.
0.85 mm Typ.
0.35 mm
1.4 mm
C
L
1.4 mm
0.7 mm
14.34 mm
Pin 1
6X 2.1 mm
6X 5 mm
0.85 mm Typ.
6X 0.725 mm
C
L
0.425 mm
14.44 mm
2.2 mm Typ.
0.25 mm
Typ.
C
L
Thermal Via Array
0.3 mm on 0.7 mm Pitch
0.35mm
Additional Vias in Common Ground
Pad Will Improve Thermal Performance
Thermal vias should be tented and filled with solder mask 30–35 µm
copper plating recommended.
0.7 mm
2X 1.525 mm
2X 1.875 mm
C
L
2 mm Typ.
8X 2.3 mm 2X 4.075 mm
Package Outline
Stencil Pattern
0.20 X 45 mm
10.34 mm
48X 0.5 mm
0.425 mm
48X 0.75 mm
0.85 mm Typ.
6X 5 mm
0.425 mm
C
L
6X 2.1 mm
14.34 mm
Stencil Aperture
Size of 80–100%
of the Module/Pkg.
Solder Mask Openings
Package
Outline
C
L
8X 2.3 mm
2X 2.975 mm
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
8
May 7, 2007 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200607 Rev. D
SKYWORKS [ SKYWORKS SOLUTIONS INC. ]
