DATA SHEET • SKY65336-11 TRANSMIT/RECEIVE FRONT-END MODULE WITH LNA
Pin 28
Pin 1
0.2 x 0.2
0.49375
6.9124
28X 0.588
R0.15 Typ
28X 0.588
0.9875 Typ
6.9124
0.49375
0.875 Typ
Stencil Aperture Size of 80 to 100%
of the Module/Pkg Solder
Mask Openings
0.875 Typ
Package Outline
Exposed Center Pad
Stencil Aperture
Top View
Thermal Via Array
∅0.3
mm
on 0.6 mm Pitch Will Improve
Thermal Performance
Pin 28
Pin 1
6.9124
13X 0.588
Pin 28
Pin 1
6.9124
0.49375
28X 0.738
R0.225 Typ
28X 0.738
1.9082
6.9124
R0.15 Typ
13X 0.588
0.9875 Typ
6.912
0.49375
2X 2.4375
0.9875 Typ
Package Outline
0.25 Typ
Package Outli
Exposed Center Pad
0.49375
Metallization
Top View
Note: The cross-hatched area represents the merger of the center
ground pad +25 individual I/O ground pads. All I/O ground
pads should have at least one via connected to internal ground
planes for optimum electrical performance.
All measurements are in millimeters
Solder Mask Opening
Top View
S1330
Figure 15. SKY65336-11 Phone Board Layout Footprint
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200939G • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 11, 2009
9
SKYWORKS [ SKYWORKS SOLUTIONS INC. ]
