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SKY77328 参数 Datasheet PDF下载

SKY77328图片预览
型号: SKY77328
PDF下载: 下载PDF文件 查看货源
内容描述: IPAC PAM支持四频GSM / GPRS [iPAC PAM for Quad-Band GSM/GPRS]
分类和应用: GSM
文件页数/大小: 19 页 / 1092 K
品牌: SKYWORKS [ SKYWORKS SOLUTIONS INC. ]
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SKY77328 iPAC™ PAM FOR QUAD-BAND GSM / GPRS  
DATA SHEET  
SMT reflow profiles can also be found in the JEDEC Standard  
J-STD–020B.  
Package and Handling Information  
Because of its sensitivity to moisture absorption, this device  
package is baked and vacuum-packed prior to shipment.  
Instructions on the shipping container label must be followed  
regarding exposure to moisture after the container seal is broken,  
otherwise, problems related to moisture absorption may occur  
when the part is subjected to high temperature during solder  
assembly.  
Production quantities of this product are shipped in the standard  
tape-and-reel format. For packaging details, refer to Skyworks  
Application Note: Tape and Reel – RF Modules, Document  
Number 101568.  
Electrostatic Discharge Sensitivity  
The SKY77328 has been classified as a Human Body Model Class  
1C (1000 volts to < 2000 volts) and Machine Model Class M2  
(100 volts to < 200 volts) device. ESD testing has been performed  
in compliance to the latest JEDEC Human Body Model  
specification, HBM (JESD22-A114-B) and Machine Model  
specification, (JESD22-A115-A). A report summarizing the ESD  
testing, including ESD failure level thresholds on each pin-to-  
ground and pin-to-pin combination may be obtained upon  
request.  
The SKY77328 is capable of withstanding an MSL3/260 °C solder  
reflow. Care must be taken when attaching this product, whether  
it is done manually or in a production solder reflow environment.  
If the part is attached in a reflow oven, the temperature ramp rate  
should not exceed 5 °C per second; maximum temperature  
should not exceed 260 °C. If the part is manually attached,  
precaution should be taken to insure that the part is not subjected  
to temperatures exceeding 260 °C for more than 10 seconds. For  
details on attachment techniques, precautions, and handling  
procedures recommended by Skyworks, please refer to Skyworks  
Application Note: PCB Design and SMT Assembly/Rework,  
Document Number 101752. Additional information on standard  
To avoid ESD damage, both latent and visible, it is very important  
that the product assembly and test areas follow the Class-1 ESD  
handling precautions listed below.  
Personnel Grounding  
Facility  
- Wrist Straps  
- Conductive Smocks, Gloves and Finger Cots  
- Antistatic ID Badges  
- Relative Humidity Control and Air Ionizers  
- Dissipative Floors (less than 109 Ω to GND)  
Protective Workstation  
Protective Packaging and Transportation  
- Dissipative Table Top  
- Bags and Pouches (Faraday Shield)  
- Protective Tote Boxes (Conductive Static Shielding)  
- Protective Trays  
- Grounded Carts  
- Protective Work Order Holders  
- Protective Test Equipment (Properly Grounded)  
- Grounded Tip Soldering Irons  
- Solder Conductive Suckers  
- Static Sensors  
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com  
103237A • Skyworks Proprietary and Confidential Information • Products and product information are subject to change without notice. • March 17, 2009  
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