DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME
Wafer On Film
0.003 (0.076 mm) Nom.
Separation
Between Die
0.003 (0.076 mm)
Separation
Between Die
5.981 (151.92 mm)
Outer Ring O.D.
5.520 (140.2 mm)
Inner Ring I.D.
3.940 (100 mm)
Wafer Dia.
0.236 (5.99 mm)
Ring Thickness
Grip Ring
Wafer Film Frame Description
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Wafer on nitto tape
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Color: light blue
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Thickness: 2.2–3 mils
●
Tensile strength: 6.6 (lbs. in width)
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Ring material: plastic
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
May 30, 2006 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200140 Rev. C
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SKYWORKS [ SKYWORKS SOLUTIONS INC. ]
