DATA SHEET • SMP1321 SERIES
Recommended Solder Reflow Profiles
Profile Feature
SnPb Eutectic Assembly
Lead (Pb)-Free Assembly 100% Sn
Average ramp-up rate (T to T )
3 °C/second max.
3 °C/second max.
L
P
Preheat
Temperature min. (T
)
100 °C
150 °C
SMIN
Temperature max. (T
)
150 °C
200 °C
SMAX
Time (min. to max.) (ts)
60–120 seconds
60–80 seconds
T
SMAX
to T
L
Ramp-up rate
—
3 °C/second max.
Time maintained above:
Temperature (T )
183 °C
217 °C
L
Time (t )
60–150 seconds
60–150 seconds
L
Peak temperature (T )
240 +0/-5 °C
250 +0/-5 °C
P
Time within 5 °C of actual peak temperature (tp)
Ramp-down rate
10–30 seconds
6 °C/second max.
6 minutes max.
20–40 seconds
6 °C/second max.
8 minutes max.
Time 25 °C to peak temperature
All temperatures refer to the topside of the package, measured on the package body surface.
Reference JEDEC J-STD-020B.
tp
TP
Critical Zone
TL to TL
TL
IL
TSMAX
TSMIN
ts
Preheat
25 ˚C
t 25 ˚C to Peak
Time
Reference JEDEC J-STD-020
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200048 Rev. B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • October 25, 2004
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