SL74LVU04
MAXIMUM RATINGS
*
Symbol
V
CC
I
IK
*
1
I
OK
*
2
I
O
*
3
I
CC
I
GND
P
D
Tstg
T
L
*
Parameter
DC supply voltage (Referenced to GND)
DC input diode current
DC output diode current
DC output source or sink current
-bus driver outputs
DC V
CC
current for types with
- bus driver outputs
DC GND current for types with
- bus driver outputs
Power dissipation per package, plastic DIP+
SOIC package+
Storage temperature
Lead temperature, 1.5 mm from Case for 10 seconds
(Plastic DIP ), 0.3 mm (SOIC Package)
Value
-0.5
÷
+7.0
±20
±50
±25
±50
±50
750
500
-65
÷
+150
260
Unit
V
mA
mA
mA
mA
mA
mW
°C
°C
Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 12 mW/°C from 70° to 125°C
SOIC Package: : - 8 mW/°C from 70° to 125°C
1
* : V
I
<
-0.5V or V
I
>
V
CC
+0.5V
*
2
: Vo
<
-0.5V or Vo
>
V
CC
+0.5V
*
3
: -0.5V
<
Vo
<
V
CC
+0.5V
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
, V
OUT
T
A
t
r
, t
f
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced
to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time
1.0 V≤V
CC
<2.0 V
2.0 V≤V
CC
<2.7 V
2.7 V≤V
CC
<3.6 V
3.6 V≤V
CC
≤5.5
V
Min
1.0
0
-40
0
0
0
0
Max
5.5
V
CC
+125
500
200
100
50
Unit
V
V
°C
ns
This device contains protection circuitry to guard against damage due to high static voltages or electric
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages
to this high-impedance circuit. For proper operation, V
IN
and V
OUT
should be constrained to the range GND≤(V
IN
or
V
OUT
)≤V
CC
.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V
CC
). Unused
outputs must be left open.
SLS
System Logic
Semiconductor
2