SL74LV04
CHIP PAD DIAGRAM SL74LV04
12
13
11
10
09
08
14
07
06
01
02
03
04
05
1.35
±
0.03
Pad size 0.108 x 0.108 mm (Pad size is given as per
metallization
layer)
Thickness of chip 0.46
±
0,02 mm
PAD LOCATION
Pad No
01
02
03
04
05
06
07
08
09
10
11
12
13
14
Symbol
À1
Y1
A2
Y2
A3
Y3
GND
Y4
A4
Y5
A5
Y6
A6
Vcc
X
0.111
0.333
0.600
0.770
1.006
1.138
1.138
1.138
1.006
0.771
0.600
0.332
0.111
0.111
Y
0.228
0.111
0.111
0.111
0.111
0.293
0.477
0.786
0.970
0.970
0.970
0.970
0.855
0.619
SLS
System Logic
Semiconductor
1.20
±
0.03
Chip marking
25LV04
(x=0.127; y=0.580
)
5