SNC759 参数 Datasheet PDF下载

Preliminary

============ CONTENTS ============

SNC759

16-bit Voice Processor

1. INTRODUCTION ..............................................................................................................................3

2. FEATURES.........................................................................................................................................3

3. PIN ASSIGNMENT ...........................................................................................................................4

4. ROM TABLE......................................................................................................................................6

5. RAM TABLE ......................................................................................................................................7

6. SYSTEM CLOCK ..............................................................................................................................8

6.1 C

RYSTAL

I

NPUT

.................................................................................................................................8

6.2 ROSC I

NPUT

......................................................................................................................................8

7. I/O PORT ............................................................................................................................................9

8. TIMER/COUNTER .........................................................................................................................10

9. PUSH-PULL DAC............................................................................................................................11

10. REGULATOR ................................................................................................................................11

11. ABSOLUTE MAXIMUM RATINGS...........................................................................................12

12. ELECTRICAL CHARACTERISTICS ........................................................................................12

13. APPLICATION CIRCUIT............................................................................................................13

14. BONDING PAD..............................................................................................................................15

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March 7, 2007