SNAP01
AB类功率放大器
============== ==============内容
1.
2.
3.
4.
5.
概述................................................ ....................................... 3
特点................................................................................................................. 3
框图................................................ .................................................. 3
引脚分配................................................ .................................................. 4 ..
电气特性................................................ ...................... 4
5.1.
5.2.
6.
A
BSOLUTE
M
AXIMUM
R
ATINGS
.............................................................................. 4
DC ç
极特
(T
A
=25℃).......................................................................... 5
应用电路................................................ ......................................... 6
6.1.
6.2.
6.3.
6.4.
6.5.
6.6.
C
光凭目前
DAC
应用程序
S
炉火
-E
ND
M
ODE
.......................................... 6
PWM
同
D
。微分
M
ODE
........................................................................... 7
P
USH
-P
ULL
DAC
同
S
炉火
-E
ND
M
ODE
............................................................ 8
P
USH
-P
ULL
DAC
同
D
。微分
M
ODE
.......................................................... 9
单端
同
混合................................................. .............................. 10
D
。微分
M
常微分方程
M
IXED
....................................................................... 11
7.
PACKAGE /焊盘位置.............................................. ................................. 12
7.1.
7.2.
7.3.
SNAP01H （D
ICE
) ................................................................................................ 12
SNAP01PG （ DIP摹
颖
P
ACKAGE
)..................................................................... 13
SNAP01SG （ SOP摹
颖
P
ACKAGE
).................................................................... 14
Ver1.3
1
2007年11月22日
SONIX [ SONIX TECHNOLOGY COMPANY ]
