CXA1622M/P
Electrical Characteristics Test Circuit
C4
10µ
R3
50k
S8
R1
25k
C3
10µ
+
R2
25k
S7
C6
3.3µ
S6
S5
+
S9
S2
16
15
14
13
12
11
10
9
P GND1
OUT1
IN1
VOL
NF1
GND
REG
V
CC
S11
R5
8
CXA1622M/P
P GND2
OUT2
GND
C1
10µ
+
RIPPLE
Y3
Y
SW
IN2
1
2
NC
3
4
NF2
S3
5
6
7
8
S1
+
+
S18
V1
RC
+
C2
10µ
+
S4
C5
3.3µ
C7
0.1µ
+
C9
10µ
C12
220µ
+
I1
A
GND
Notes on Operation
•
Set print pattern to low impedance because Pins 6 and 11 are GND of power amplifier output stage.
•
The value of the phase correction capacitance attached to Pins 7 and 10 varies slightly according to the
print pattern.
•
Provide a large land for DIP type Pin 5 because it also serves as heat dissipation pin.
•
Place the by-pass capacitor of V
CC
(Pin 9) as close to the pin as possible.
—7—
+
+
C8
0.1µ
V2
3V
C10 C11
0.1µ 220µ
C13
220µ
V
R6
8
V4
S12
R4
8
V5
V
S13
V6
V
S14
SONY [ SONY CORPORATION ]
