D A T A
S H E E T
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Am29DL32xG
T
70
E
I
OPTIONAL PROCESSING
Blank = Standard Processing
N
= 16-byte ESN devices
(Contact an AMD representative for more information)
TEMPERATURE RANGE
I
= Industrial (–40
°
C to +85
°
C)
F
= Industrial (–40
°
C to +85
°
C) with Pb-free package
PACKAGE TYPE
E
= 48-Pin Thin Small Outline Package
(TSOP) Standard Pinout (TS 048)
WD = 63-Ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 8 x 14 mm package (FBD063)
WM = 48-Ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 6 x 12 mm package (FBD048)
PC
= 64-Ball Fortified Pitch Ball Grid Array (FBGA)
1.00 mm pitch, 11 x 13 mm package (LAA064)
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
=
Top sector
B
=
Bottom sector
DEVICE NUMBER/DESCRIPTION
Am29DL32xG
32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS Flash Memory
3.0 Volt-only Read, Program, and Erase
Valid Combinations for TSOP Packages
AM29DL322GT70,
AM29DL322GB70
AM29DL323GT70
AM29DL323GB70
AM29DL324GT70,
AM29DL324GB70
AM29DL322GT90,
AM29DL322GB90
AM29DL323GT90,
AM29DL323GB90
AM29DL324GT90,
AM29DL324GB90
AM29DL322GT120,
AM29DL322GB120
AM29DL323GT120,
AM29DL323GB120
AM29DL324GT120,
AM29DL324GB120
EI, EIN,
EF
Valid Combinations for FBGA Packages
Order Number
AM29DL322GT70,
AM29DL322GB70
AM29DL323GT70,
AM29DL323GB70
AM29DL324GT70,
AM29DL324GB70
AM29DL322GT90,
AM29DL322GB90
AM29DL323GT90,
AM29DL323GB90
AM29DL324GT90,
AM29DL324GB90
AM29DL322GT120,
AM29DL322GB120
AM29DL323GT120,
AM29DL323GB120
AM29DL324GT120,
AM29DL324GB120
Package Marking
D322GT70U,
D322GB70U
D323GT70U,
D323GB70U
D324GT70U,
D324GB70U
D322GT90U,
D322GB90U
I, F
WMI,
D323GT90U,
WMIN,
D323GB90U
WMF
D324GT90U,
D324GB90U
D322GT12U,
D322GB12U
D323GT12U,
D323GB12U
D324GT12U,
D324GB12U
8
Am29DL32xG
25686B10 December 4, 2006
SPANSION [ SPANSION ]
