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    S29AL016M90TFIR10 参数 Datasheet PDF下载

    S29AL016M90TFIR10图片预览
    型号： S29AL016M90TFIR10
    PDF下载： 下载PDF文件 查看货源
    内容描述： 16兆位（ 2M ×8位/ IMX 16位）， 3.0伏只引导扇区闪存 [16 MEGABIT (2M X 8 BIT / I M X 16 BIT) 3.0 VOLT ONLY BOOT SECTOR FLASH MEMORY]
    分类和应用： 闪存
    文件页数/大小： 59 页 / 2056 K
    品牌： SPANSION [ SPANSION ]
     浏览型号S29AL016M90TFIR10的Datasheet PDF文件第1页浏览型号S29AL016M90TFIR10的Datasheet PDF文件第2页浏览型号S29AL016M90TFIR10的Datasheet PDF文件第4页浏览型号S29AL016M90TFIR10的Datasheet PDF文件第5页浏览型号S29AL016M90TFIR10的Datasheet PDF文件第6页浏览型号S29AL016M90TFIR10的Datasheet PDF文件第7页浏览型号S29AL016M90TFIR10的Datasheet PDF文件第8页浏览型号S29AL016M90TFIR10的Datasheet PDF文件第9页  
    Table of Contents
    S29AL016M 2
    General Description 3
    Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
    Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
    Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6
    Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 9
    Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
    Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 10
    Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 11
    Table 1. S29AL016M Device Bus Operations .........................11
    Figure 5. Erase Operation .................................................. 30
    Program Suspend/Program Resume Command Sequence ...... 30
    Figure 6. Program Suspend/Program Resume ....................... 31
    Command Definitions Tables ........................................................... 32
    Write Operation Status . . . . . . . . . . . . . . . . . . . . . 34
    DQ7: Data# Polling .............................................................................. 34
    RY/BY#: Ready/Busy# ..........................................................................35
    DQ6: Toggle Bit I .................................................................................. 36
    DQ2: Toggle Bit II ................................................................................ 36
    Reading Toggle Bits DQ6/DQ2 .........................................................37
    Figure 8. Toggle Bit Algorithm ............................................ 38
    Command Definitions (x16 Mode, BYTE# = V
    IH
    ).................... 32
    Command Definitions (x8 Mode, BYTE# = V
    IL
    )...................... 33
    Figure 7. Data# Polling Algorithm ....................................... 35
    Word/Byte Configuration .................................................................... 11
    Requirements for Reading Array Data ............................................ 11
    Writing Commands/Command Sequences ................................... 12
    Program and Erase Operation Status .............................................. 12
    Standby Mode ......................................................................................... 12
    Automatic Sleep Mode ......................................................................... 13
    RESET#: Hardware Reset Pin ............................................................ 13
    Output Disable Mode ........................................................................... 13
    Table 2. Sector Address Tables (Model 01, Top Boot Device) ...14
    Table 3. Sector Address Tables (Model 02, Bottom Boot Device) .
    15
    DQ5: Exceeded Timing Limits .......................................................... 38
    DQ3: Sector Erase Timer .................................................................. 39
    Table 12. Write Operation Status ....................................... 39
    Absolute Maximum Ratings . . . . . . . . . . . . . . . . .40
    Figure 9. Maximum Negative Overshoot Waveform................ 40
    Figure 10. Maximum Positive Overshoot Waveform................ 40
    Autoselect Mode ................................................................................... 15
    Table 4. Autoselect Codes (High Voltage Method) ..................16
    Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 40
    DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 41
    Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . .42
    Figure 11. Test Setup ........................................................ 42
    Table 13. Test Specifications ............................................. 42
    Figure 12. Input Waveforms and Measurement Levels............ 42
    Sector Protection/Unprotection ....................................................... 16
    Temporary Sector Unprotect ........................................................... 17
    Figure 1. Temporary Sector Unprotect Operation................... 17
    Figure 2. In-System Single High Voltage Sector Protect/
    Unprotect Algorithms ........................................................ 18
    AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 43
    Read Operations ................................................................................... 43
    Figure 13. Read Operations Timings .................................... 43
    SecSi (Secured Silicon) Sector Flash Memory Region ................ 19
    Table 5. SecSi Sector Addressing ........................................19
    Hardware Reset (RESET#) ................................................................ 44
    Figure 14. RESET# Timings ................................................ 44
    Customer Lockable: SecSi Sector NOT Programmed or Pro-
    tected At the Factory ........................................................................... 19
    Figure 3. SecSi Sector Protect Verify ................................... 20
    Erase/Program Operations ................................................................ 45
    Figure 15. Program Operation Timings ................................. 46
    Figure 16. Chip/Sector Erase Operation Timings.................... 47
    Figure 17. Data# Polling Timings
    (During Embedded Algorithms)........................................... 48
    Figure 18. Toggle Bit Timings
    (During Embedded Algorithms)........................................... 48
    Figure 19. DQ2 vs. DQ6 for Erase and
    Erase Suspend Operations ................................................. 49
    Figure 20. Temporary Sector Unprotect/Timing Diagram ........ 49
    Figure 21. Sector Protect/Unprotect Timing Diagram.............. 50
    Figure 22. Alternate CE# Controlled Write Operation Timings.. 52
    Common Flash Memory Interface (CFI) .......................................20
    Table 6. CFI Query Identification String ...............................21
    Table 7. System Interface String .........................................22
    Table 8. Device Geometry Definition ....................................22
    Table 9. Primary Vendor-Specific Extended Query .................23
    Hardware Data Protection ................................................................ 23
    Low V
    CC
    Write Inhibit ....................................................................... 23
    Write Pulse “Glitch” Protection ...................................................... 23
    Logical Inhibit ......................................................................................... 24
    Power-Up Write Inhibit ..................................................................... 24
    Command Definitions . . . . . . . . . . . . . . . . . . . . . .24
    Reading Array Data ............................................................................. 24
    Reset Command ................................................................................... 24
    Autoselect Command Sequence ...................................................... 25
    Word/Byte Program Command Sequence ................................... 25
    Unlock Bypass Command Sequence ............................................... 26
    Figure 4. Program Operation .............................................. 27
    Chip Erase Command Sequence ...................................................... 27
    Sector Erase Command Sequence ..................................................28
    Erase Suspend/Erase Resume Commands ....................................28
    Erase and Programming Performance . . . . . . . . . 53
    TSOP Pin and BGA Package Capacitance . . . . . 53
    Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 54
    TS 048—48-Pin Standard TSOP ...................................................... 54
    TSR048—48-Pin Reverse TSOP ...................................................... 55
    FBA048—48-Ball Fine-Pitch Ball Grid Array (BGA)
    6 x 8 mm Package ................................................................................. 56
    LAA064—64-Ball Fortified Ball Grid Array (BGA)
    13 x 11 mm Package ............................................................................... 57
    Revision Summary. . . . . . . . . . . . . . . . . . . . . . . . . 58
    April 21, 2004 S29AL016M_00A4
    S29AL016M
    4

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