D at a
S hee t
(Adva nce
In for m ation)
4.4
TS056—56-Pin Standard Thin Small Outline Package (TSOP)
Figure 4.3
56-Pin Thin Small Outline Package (TSOP), 14 x 20 mm
PACKAGE
JEDEC
SYMBOL
A
A1
A2
b1
b
c1
c
D
D1
E
e
L
O
TS 56
MO-142 (B) EC
MIN.
---
0.05
0.95
0.17
0.17
0.10
0.10
19.80
18.30
13.90
0.50
0˚
0.08
NOM.
---
---
1.00
0.20
0.22
---
---
20.00
18.40
14.00
0.50 BASIC
0.60
-
---
56
0.70
8˚
0.20
MAX.
1.20
0.15
1.05
0.23
0.27
0.16
0.21
20.20
18.50
14.10
NOTES:
1
2
3
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE
LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
MOLD PROTUSION IS 0.15 mm PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE
DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b
DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN
PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.
THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10 mm AND 0.25 mm FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE
SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
4
5
6
7
8
R
N
3160\38.10A
November 21, 2006 S29GL-P_00_A3
S29GL-P MirrorBit
TM
Flash Family
11
SPANSION [ SPANSION ]
