D a t a S h e e t
7. Ordering Information–S29GL064N
S29GL064N Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
S29GL064N 90
T
A
I
02
2
PACKING TYPE
0
2
3
=
=
=
Tray
7-inch Tape and Reel
13-inch Tape and Reel
MODEL NUMBER
01
02
03
04
06
07
=
=
=
=
=
=
x8/x16, V = V = 2.7 – 3.6 V, Uniform sector, WP#/ACC = V protects highest addressed sector
CC IO IL
x8/x16, V = V = 2.7 – 3.6 V, Uniform sector, WP#/ACC = V protects lowest addressed sector
CC
IO
IL
x8/x16, V = 2.7 – 3.6 V, Top boot sector, WP#/ACC = V protects top two addressed sectors
CC
IL
x8/x16, V = 2.7 – 3.6 V, Bottom boot sector, WP#/ACC = V protects bottom two addressed sectors
CC
IL
x16, V = 2.7 – 3.6 V, Uniform sector, WP# = V protects highest addressed sector
CC
IL
x16, V = 2.7 – 3.6 V, Uniform sector, WP# = V protects lowest addressed sector
CC
IL
V1 = x8/x16, V = 2.7 – 3.6 V, V = 1.65 - 3.6 V, Uniform sector, WP#/ACC = V protects highest addressed sector
CC
IO
IL
V2 = x8/x16, V = 2.7 – 3.6 V, V = 1.65 - 3.6 V, Uniform sector, WP#/ACC = V protects lowest addressed sector
CC
IO
IL
V6 = x16, V = 2.7 – 3.6 V, V = 1.65 - 3.6 V, Uniform sector, WP# = V protects highest addressed sector
CC
IO
IL
V7 = x16, V = 2.7 – 3.6 V, V = 1.65 - 3.6 V, Uniform sector, WP# = V protects lowest addressed sector
CC
IO
IL
TEMPERATURE RANGE
I
=
Industrial (–40°C to +85°C)
PACKAGE MATERIAL SET
A
F
=
=
Standard (Note 4)
Pb-Free
PACKAGE TYPE
T
B
F
=
=
=
Thin Small Outline Package (TSOP) Standard Pinout
Fine-pitch Ball-Grid Array Package
Fortified Ball-Grid Array Package
SPEED OPTION
See Product Selector Guide and Valid Combinations (90 = 90 ns, 11 = 110 ns)
DEVICE NUMBER/DESCRIPTION
S29GL064N, 64 Megabit Page-Mode Flash Memory
Manufactured using 110 nm MirrorBit® Process Technology, 3.0 Volt-only Read, Program, and Erase
Table 7.1 S29GL064N Valid Combinations (Note 4)
S29GL064N Valid Combinations
Package Description
Package, Material &
Temperature Range
Packing
Type
Device Number
Speed Option
Model Number
90
11
90
11
90
90
11
03, 04, 06, 07
V6, V7
TS048 (Note 2)
TSOP
TFI
01, 02
TS056 (Note 2)
TSOP
0, 2, 3
S29GL064N
V1, V2
(Note 1)
BFI
FFI
03, 04
VBK048 (Note 3)
LAA064 (Note 3)
Valid Combinations
Fine-pitch BGA
Fortified BGA
01, 02, 03, 04
V1, V2
Notes
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be
packed in Types 0, 2, or 3.
Valid Combinations list configurations
planned to be supported in volume for this
device. Consult your local sales office to
confirm availability of specific valid
combinations and to check on newly
released combinations.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading S29 and packing type designator from ordering part number.
4. Contact local sales for availability for Leaded lead-frame parts.
8. Device Bus Operations
This section describes the requirements and use of the device bus operations, which are initiated through the
internal command register. The command register itself does not occupy any addressable memory location.
The register is a latch used to store the commands, along with the address and data information needed to
16
S29GL-N MirrorBit® Flash Family
S29GL-N_01_09 November 16, 2007
SPANSION [ SPANSION ]
