S71GL016A40BFW3J0 参数 Datasheet PDF下载

Da ta

S h ee t

( Ad va nce

I nfor m at ion )

6.

Ordering Information

The order number is formed by a valid combinations of the following:

S71GL

016

A

40

BA

W

3J

0

Packing Type

0 = Tray

2 = 7” Tape and Reel

3 = 13” Tape and Reel

Model Number

See the Valid Combinations table

Temperature Range

W = Wireless (-25×C to +85×C)

Package Type

BA = Fine-pitch BGA Lead (Pb)-free compliant package

BF = Fine-pitch BGA Lead (Pb)-free package

pSRAM Density

40 = 4 Mb pSRAM

Process Technology

A = 200 nm, MirrorBit Technology

Flash Density

016= 16Mb

Product Family

S71GL Multi-chip Product (MCP) 3.0-volt Page Mode Flash Memory and RAM

6.1

Valid Combinations

Valid Combinations list configurations planned to be supported in volume for this device. Consult your local

sales office to confirm availability of specific valid combinations and to check on newly released

combinations.

Base Ordering

Part Number

S71GL016A40

BAW

S71GL016A40

S71GL016A40

BFW

S71GL016A40

1J

100 / Top Boot Sector

1J

3J

100 / Top Boot Sector

0, 2, 3

(See Note)

100 / Bottom Boot Sector

pSRAM4/ 70

TLC056

Package &

Temperature

Package Modifier/

Model Number

3J

Packing

Type

Speed Options (ns)/

Boot Sector Option

100 / Bottom Boot Sector

pSRAM Type/

Access Time (ns)

Package

Marking

Note:

Type 0 is standard. Specify other options as required.

June 20, 2006 S71GL016A_00_A1

S71GL016A Based MCPs

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