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S71PL129JC0BAW9U0 参数 Datasheet PDF下载

S71PL129JC0BAW9U0图片预览
型号: S71PL129JC0BAW9U0
PDF下载: 下载PDF文件 查看货源
内容描述: 堆叠式多芯片产品( MCP )闪存 [Stacked Multi-Chip Product (MCP) Flash Memory]
分类和应用: 闪存存储内存集成电路静态存储器
文件页数/大小: 149 页 / 2994 K
品牌: SPANSION [ SPANSION ]
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S71PL129JC0/S71PL129JB0/S71PL129JA0
Stacked Multi-Chip Product (MCP) Flash Memory and
pSRAM 128 Megabit (8M x 16-bit) CMOS 3.0 Volt-only
Simultaneous Operation, Page Mode Flash Memory with
64/32/16 Megabit (4M/2M/1M x 16-bit) Pseudo-Static RAM
ADVANCE
INFORMATION
Distinctive Characteristics
MCP Features
Power supply voltage of 2.7 to 3.1 volt
High performance
— 65ns (65ns Flash, 70ns pSRAM)
Package
— 8 x 11.6 x 1.2 mm 64 ball FBGA
Operating Temperature
— –25°C to +85°C (Wireless)
— –40°C to +85°C (Industrial)
Dual CE# Flash memory
General Description
The S71PL129J series is a product line of stacked Multi-Chip Product (MCP) pack-
ages and consists of:
One S29PL129J Flash memory die
One 16M, 32M, or 64M pSRAM
The products covered by this document are listed in the table below. For details
about their specifications, please refer to the individual constituent datasheets for
further details.
Flash Memory Density
128Mb
64Mb
pSRAM
Density
32Mb
16Mb
S71PL129JC0
S71PL129JB0
S71PL129JA0
Publication Number
S71PL129Jxx_00
Revision
A
Amendment
5
Issue Date
December 23, 2004
This document contains information on a product under development at Spansion, LLC. The information is intended to help you evaluate this product. Do not design in
this product without contacting the factory. Spansion reserves the right to change or discontinue work on this proposed product without notice.