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S71WS256ND0BFWYP3 参数 Datasheet PDF下载

S71WS256ND0BFWYP3图片预览
型号: S71WS256ND0BFWYP3
PDF下载: 下载PDF文件 查看货源
内容描述: 堆叠式多芯片产品( MCP ) [Stacked Multi-Chip Product (MCP)]
分类和应用:
文件页数/大小: 13 页 / 334 K
品牌: SPANSION [ SPANSION ]
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S71WS-N
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
Data Sheet
(Advance Information)
S71WS-N Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
for definitions.
Publication Number
S71WS-N_00
Revision
A
Amendment
6
Issue Date
July 19, 2006