512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST39LF512 / SST39LF010 / SST39LF020 / SST39LF040
SST39VF512 / SST39VF010 / SST39VF020 / SST39VF040
Data Sheet
TABLE 4: SOFTWARE COMMAND SEQUENCE
Command
Sequence
1st Bus
Write Cycle
2nd Bus
Write Cycle
3rd Bus
Write Cycle
4th Bus
Write Cycle
5th Bus
Write Cycle
6th Bus
Write Cycle
Addr1 Data Addr1 Data Addr1 Data Addr1 Data Addr1 Data Addr1 Data
5555H AAH 2AAAH 55H 5555H A0H Data
BA2
5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H
Byte-Program
3
Sector-Erase
SAX
30H
Chip-Erase
5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H 5555H 10H
5555H AAH 2AAAH 55H 5555H 90H
Software ID Entry4,5
Software ID Exit6
Software ID Exit6
XXH
F0H
5555H AAH 2AAAH 55H 5555H F0H
T4.2 395
1. Address format A14-A0 (Hex),
Address A15 can be VIL or VIH, but no other value, for the Command sequence for SST39LF/VF512.
Addresses A15-A16 can be VIL or VIH, but no other value, for the Command sequence for SST39LF/VF010.
Addresses A15-A17 can be VIL or VIH, but no other value, for the Command sequence for SST39LF/VF020.
Addresses A15-A18 can be VIL or VIH, but no other value, for the Command sequence for SST39LF/VF040.
2. BA = Program Byte address
3. SAX for Sector-Erase; uses AMS-A12 address lines
AMS = Most significant address
AMS = A15 for SST39LF/VF512, A16 for SST39LF/VF010, A17 for SST39LF/VF020, and A18 for SST39LF/VF040
4. The device does not remain in Software Product ID Mode if powered down.
5. With AMS-A1 =0; SST Manufacturer’s ID= BFH, is read with A0 = 0,
SST39LF/VF512 Device ID = D4H, is read with A0 = 1
SST39LF/VF010 Device ID = D5H, is read with A0 = 1
SST39LF/VF020 Device ID = D6H, is read with A0 = 1
SST39LF/VF040 Device ID = D7H, is read with A0 = 1
6. Both Software ID Exit operations are equivalent
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD + 0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . .-1.0V to VDD + 1.0V
Voltage on A9 Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 13.2V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
OPERATING RANGE FOR SST39LF512/010/020/040
AC CONDITIONS OF TEST
Input Rise/Fall Time . . . . . . . . . . . . . . . 5 ns
Range
Ambient Temp
VDD
Output Load
Commercial
0°C to +70°C
3.0-3.6V
CL = 30 pF for SST39LF512/010/020/040
OPERATING RANGE FOR SST39VF512/010/020/040
CL = 100 pF for SST39VF512/010/020/040
See Figures 13 and 14
Range
Ambient Temp
0°C to +70°C
VDD
Commercial
Industrial
2.7-3.6V
2.7-3.6V
-40°C to +85°C
©2001 Silicon Storage Technology, Inc.
S71150-03-000 6/01 395
7
SST [ SILICON STORAGE TECHNOLOGY, INC ]
