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SST39VF800 参数 Datasheet PDF下载

SST39VF800图片预览
型号: SST39VF800
PDF下载: 下载PDF文件 查看货源
内容描述: 8兆位( 512K ×16位)多用途闪存 [8 Megabit (512K x 16-Bit) Multi-Purpose Flash]
分类和应用: 闪存
文件页数/大小: 23 页 / 251 K
品牌: SST [ SILICON STORAGE TECHNOLOGY, INC ]
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8 Megabit (512K x 16-Bit) Multi-Purpose Flash
SST39VF800Q / SST39VF800
Advance Information
FEATURES:
• Organized as 512 K X 16
• Single 2.7-3.6V Read and Write Operations
• V
DDQ
Power Supply to Support 5V I/O
for SST39VF800Q
- V
DDQ
not available on SST39VF800
• Superior Reliability
- Endurance: 100,000 Cycles (typical)
- Greater than 100 years Data Retention
• Low Power Consumption:
- Active Current: 15 mA (typical)
- Standby Current: 3 µA (typical)
- Auto Low Power Mode: 3 µA (typical)
• Small Sector Erase Capability (256 sectors)
- Uniform 2 KWord sectors
• Block Erase Capability (16 blocks)
- Uniform 32 KWord blocks
• Fast Read Access Time:
- 70 and 90 ns
PRODUCT DESCRIPTION
The SST39VF800Q/VF800 devices are 512K x 16
CMOS Multi-Purpose Flash (MPF) manufactured with
SST’s proprietary, high performance CMOS SuperFlash
technology. The split-gate cell design and thick oxide
tunneling injector attain better reliability and
manufacturability compared with alternate approaches.
The SST39VF800Q/VF800 write (Program or Erase)
with a 2.7-3.6V power supply. The SST39VF800Q/
VF800 conform to JEDEC standard pinouts for x16
memories.
Featuring high performance word program, the
SST39VF800Q/VF800 devices provide a typical word
program time of 14 µsec. The entire memory can typi-
cally be erased and programmed word-by-word in 8
seconds, when using interface features such as Toggle
Bit or Data# Polling to indicate the completion of Program
operation. To protect against inadvertent write, the
SST39VF800Q/VF800 have on-chip hardware and soft-
ware data protection schemes. Designed, manufac-
tured, and tested for a wide spectrum of applications, the
SST39VF800Q/VF800 are offered with a guaranteed
endurance of 10,000 cycles. Data retention is rated at
greater than 100 years.
The SST39VF800Q/VF800 devices are suited for appli-
cations that require convenient and economical updating
of program, configuration, or data memory. For all sys-
tem applications, the SST39VF800Q/VF800 signifi-
cantly improve performance and reliability, while lower-
ing power consumption. The SST39VF800Q/VF800 in-
• Latched Address and Data
• Fast Sector Erase and Word Program:
- Sector Erase Time: 18 ms (typical)
- Block Erase Time: 18 ms (typical)
- Chip Erase Time: 70 ms (typical)
- Word Program time: 14 µs (typical)
- Chip Rewrite Time: 8 seconds (typical)
• Automatic Write Timing
- Internal V
PP
Generation
• End of Write Detection
- Toggle Bit
- Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard
- Flash EEPROM Pinouts and command sets
• Packages Available
- 48-Pin TSOP (12mm x 20mm)
- 6 x 8 Ball TFBGA
herently use less energy during Erase and Program than
alternative flash technologies. The total energy con-
sumed is a function of the applied voltage, current, and
time of application. Since for any given voltage range, the
SuperFlash technology uses less current to program and
has a shorter erase time, the total energy consumed
during any Erase or Program operation is less than
alternative flash technologies. The SST39VF800Q/
VF800 also improve flexibility while lowering the cost for
program, data, and configuration storage applications.
The SuperFlash technology provides fixed Erase and
Program times, independent of the number of Erase/
Program cycles that have occurred. Therefore the sys-
tem software or hardware does not have to be modified
or de-rated as is necessary with alternative flash tech-
nologies, whose erase and program times increase with
accumulated Erase/Program cycles.
To meet high density, surface mount requirements, the
SST39VF800Q/VF800 are offered in 48-pin TSOP and
48-pin TFBGA packages. See Figures 1 and 2 for
pinouts.
Device Operation
Commands are used to initiate the memory operation
functions of the device. Commands are written to the
device using standard microprocessor write sequences.
A command is written by asserting WE# low while
keeping CE# low. The address bus is latched on the
falling edge of WE# or CE#, whichever occurs last. The
data bus is latched on the rising edge of WE# or CE#,
whichever occurs first.
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© 1999 Silicon Storage Technology, Inc.The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc. MPF is a trademark of Silicon Storage Technology, Inc.
343-04 2/99
These specifications are subject to change without notice.
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