5066X Series
Features
Package
φ5
Round shape type,
HBG,HPG : Pale Green Clear epoxy
HPY,HAY : Pale Yellow Clear epoxy
HAA : Pale Orange Clear epoxy
HBR : Pale Red Clear epoxy
Single Color High Brightness
φ5
Type
Product features
・Outer
Dimension
φ5
Round shape type
・Operation
temperature range.
Storage Temperature
:-30℃�½�100℃
Operating Temperature
:-30℃�½�85℃
・Lead–free
soldering compatible
・RoHS
compliant
Dominant wavelength
Green
Yellow Green
Yellow
Orange
Red
:
:
:
:
:
:
558nm (HBG)
567nm (HPG)
572nm (HPY)
590nm (HAY)
606nm (HAA)
647nm (HBR)
Half Intensity Angle
HBG, HPG,HAY,HAA : 8 deg.
HPY : 10 deg.
HBR : 6 deg.
HBG,HPG,HPY : GaP
HAY,HAA : GaAsP
HBR : GaAlAs
Die materials
Rank grouping parameter
Soldering methods
ESD
Packing
Sorted by luminous intensity per rank taping
TTW (Through The Wave) soldering and manual soldering
More than 2kV(HBM)
Bulk : 200pcs(MIN.)
Recommended Applications
Amusement Equipment, Electric Household Appliances, OA/FA, Other General Applications
2006.7.31
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