WR5005S
Single Color
φ5
Round Shape Type
TTW (Through The Wave) soldering Conditions
Pre-heating
Solder Bath Temp.
Dipping Time
100
℃
265℃
5 s
(MAX.
)
(MAX.)
(MAX.)
1) The dip soldering process shall be 2 times maximum.
2) The product shall be cooled to room temp. before the second dipping process.
※The
detail is described to LED and Photodetector handling precautions of home page:
"Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation,
please.
Manual Soldering Conditions
Iron tip temp.
Soldering time and frequency
400℃
(MAX.)
3 s
(MAX.)
2 times (MAX.)
※The
detail is described to LED and Photodetector handling precautions of home page:
"Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please.
2009.11.03
Page 8
STANLEY [ STANLEY ELECTRIC CO.,LTD. ]
