BCC
Bump Chip Carrier
BCC+ (exposed paddle without ground ring)
• Saw singulated format
• Package height 0.8mm max.
• Square body size (rectangular body designable)
• Staggered dual row or single row bump design
BCC++ (exposed paddle with ground ring)
BCCs++ (staggered dual row design)
FEATURES
• Body sizes: 4 x 4mm to 9 x 9mm
• Lead pitch: 0.50mm and 0.80mm
• Custom body / lead / pitch configurations available
• Package profile heights (overall): maximum 0.80mm
• Both single row & dual row design
• Ni / Pd / Au plated bumps
• Excellent thermal and electrical performance
• Full in-house package and leadframe design capability
• Full in-house electrical, thermal and mechanical
simulation and measurement capability
• JEDEC standard compliant
DESCRIPTION
STATS ChipPAC’s Bump Chip Carrier (BCC) technology pro-
duces a chip scale leadframe based molded package with
bumps which are formed after the leadframe is etched away.
An exposed die pad coupled with extremely low RLC provides
excellent electrical and thermal performance enhancements
which are ideal for high frequency and high power applica-
tions especially for handheld portable applications such as
cell phones. The BCC is manufactured in a molded array
format that maximizes product throughput and material
utilization. The BCC is available with single row and dual row
bumps in BCC++ and BCC+. Overall package profile height is
0.80mm maximum.
APPLICATIONS
• RF
• Power Management
• Analog/Linear
• Logic
• Applications requiring enhanced electrical and thermal
performance and reduced package size and weight
www.statschippac.com
STATSCHIP [ STATS CHIPPAC, LTD. ]
