FBGA
Fine Pitch Ball Grid Array
• Array molded, cost effective, space
saving package solution
• Available in 1.40mm (LFBGA),
1.20mm (TFBGA), and 1.00mm
(VFBGA), 0.80mm (WFBGA) and
0.55mm (UFBGA) maximum
thickness
• Laminate substrate based package
which enables 2 and 4 layers of
routing flexibility
FEATURES
• Thin, lightweight, space saving package
• Flexible body sizes range from 4mm x 4mm to
23mm x 23mm
• 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch
• Eutectic & Pb free solder balls
• Green package available
• Multiple routing layers and dedicated ground/power
planes available for improved electrical performance
• BT laminate materials (2 and 4 metal layers)
• JEDEC standard compliant
DESCRIPTION
STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a
laminate substrate based chip scale package with plastic
overmolded encapsulation and an array of fine pitch solder
ball terminals. The FBGA package’s reduced outline and
thickness and higher density options make it an ideal
advanced technology packaging solution for high perform-
ance and/or portable applications. The use of the latest
materials and advanced assembly infrastructure produce a
reliable and cost effective package. Lead free and halogen
free compatible material sets are available. STATS ChipPAC’s
FBGA is available in a broad range of JEDEC standard body
sizes with LFBGA (<1.70mm [typically <1.40mm]), TFBGA
(<1.20mm), VFBGA (<1.00mm), WFBGA (<0.80mm) and
UFBGA (0.55mm max.) thickness. LFBGA-H (with attached
heatsink) is qualified for small body sizes.
APPLICATIONS
• Microprocessors/Controllers
• Wireless RF
• Analog
• ASIC
• Memory
• Simple PLDs
• Others
www.statschippac.com
STATSCHIP [ STATS CHIPPAC, LTD. ]
