TSSOP
and
MSOP
Small Outline Packages
SPECIFICATIONS (TSSOP)
Die Thickness
Gold Wire
Lead Finish
Marking
Packing Options
9-11mil range preferred (TSSOP)
6-16mil range preferred (TSSOP-ep)
20µm (0.8mils) diameter, 99.99% Au
Sn/Pb (85/15%) or Matte Tin
Laser
Tube
RELIABILITY (all)
Temperature Cycling
Temp/Humidity Test
Pressure Cooker Test
Condition C, -65°C/150°C, 1000 cycles
85°C/85% RH, 1000 hrs
121°C, 100% RH, 2 atm, 250 hrs
SPECIFICATIONS (MSOP)
Die Thickness
Gold Wire
Lead Finish
Marking
Packing Options
6-9mil range preferred
20µm (0.8mils) diameter, 99.99% Au
Sn/Pb (85/15%) or Matte Tin
Laser
Tube
THERMAL PERFORMANCE,
θ
ja (°C/W)
Package
30L TSSOP
30L TSSOP-ep
Body Size (mm)
4.4 x 7.8 x 0.9
4.4 x 7.8 x 0.9
Pad Size
3.0 x 3.0
3.0 x 3.0
Die Size
2.54 x 2.54
2.54 x 2.54
PCB Vias
0
9
Thermal Performance
θ
ja (°C/W)
74.0
49.5
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-5) under natural convection as defined in JESD51.2.
ELECTRICAL PERFORMANCE:
4.4 x 9.7 x 0.9 (38L)
Conductor
Component
Lead
Wire
TOTALS
Note: Results are simulated values at 100MHz.
Pad Size
(mm)
185 x 113
Lead/Wire
(mm)
0.6-3.09
1.65
Resistance
(mOhm)
5-25
99
104-124
Inductance
Self (nH)
Mutual (nH)
0.30-1.70
1.36
1.66-3.06
0.14-0.77
0.37-0.65
0.51-1.42
Capacitance
Self (pF)
Mutual (pF)
0.09-0.46
0.08
0.17-0.54
0.04-0.21
0.01-0.02
0.05-0.23
CROSS-SECTION
TSSOP
TSSOP-ep
PACKAGE CONFIGURATIONS
Package
TSSOP
Body Size (mm)
3.0 x 4.4
5.0 x 4.4
6.5 x 4.4
7.8 x 4.4
9.7 x 4.4
7.8 x 4.4
Lead Count
8
14, 16
20
24
38
30
48
56
8, 10
MSOP
MSOP
12.5 x 6.1
14.0 x 6.1
3.0 x 3.0
Corporate Office
Global Offices
10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
USA 510-979-8000
JAPAN 81-43-351-3320
KOREA 82-31-639-8911 TAIWAN 886-3-593-6565
CHINA 86-21-5976-5858
UK 44-1483-413-700
MALAYSIA 603-4257-6222
NETHERLANDS 31-38-333-2023
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks
of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information
will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.
STATS ChipPAC reserves the right to change the information at any time and without notice.
©Copyright 2005. STATS ChipPAC Ltd. All rights reserved.
January 2005
STATSCHIP [ STATS CHIPPAC, LTD. ]
