STM809/810/811/812
MAXIMUM RATING
Stressing the device above the rating listed in the
Absolute Maximum Ratings” table may cause per-
manent damage to the device. These are stress
ratings only and operation of the device at these or
any other conditions above those indicated in the
Operating sections of this specification is not im-
Table 3. Absolute Maximum Ratings
Symbol
T
STG
T
SLD(1)
V
IO
V
CC
I
O
P
D
Parameter
Storage Temperature (V
CC
Off)
Lead Solder Temperature for 10 seconds
Input or Output Voltage
Supply Voltage
Output Current
Power Dissipation
Value
–55 to 150
260
–0.3 to V
CC
+0.3
–0.3 to 7.0
20
320
Unit
°C
°C
V
V
mA
mW
plied. Exposure to Absolute Maximum Rating con-
ditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics
SURE Program and other relevant quality docu-
ments.
Note: 1. Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C for between 90 to 150
seconds).
10/18
STMICROELECTRONICS [ STMICROELECTRONICS ]
