TDA1175P
MOUNTING INSTRUCTION
The R
th (j-a)
can be reduced by soldering the GND
pins to a suitable copper area of the printed circuit
board (Figure 5) or to an external heatsink (Fig-
ure 6).
The diagram of Figure 7 shows the maximum
dissipable power P
tot
and the R
th (j-a)
as a function
of the side ”I” of two equal square copper areas
Figure 5 :
Example of P.C. Board Copper Area
having a thicknessof 35µ (1.4 mils).
During soldering the pins temperature must not
exceed 260°C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 6 :
External Heatsink Mounting Example
Figure 7 :
Maximum Power Dissipation and
Junction-ambient Thermal
Resistance versus ”I”
1175P-10.EPS
Figure 8 :
Maximum Allowable Power Dissipation
versus Ambient Temperature
1175P-12.EPS
7/8
1175P-13.EPS
1175P-11.EPS
STMICROELECTRONICS [ STMICROELECTRONICS ]
