CL330
8-Lead SOIC (w/Heat Slug) Package Outline (SG)
4.90x3.90mm body, 1.70mm height (max), 1.27mm pitch
D1
8
Exposed
Thermal
Pad Zone
D
8
θ1
Note 1
(Index Area
D/2 x E1/2)
E1
E
E2
L2
Gauge
Plane
1
1
L1
L
θ
Seating
Plane
Top View
A
Bottom View
View
B
View B
h
h
A A2
e
Seating
Plane
Note 1
A1
b
A
Side View
View A-A
Note 1:
This chamfer feature is optional. If it is not present, then a Pin 1 identifier must be located in the index area indicated.The Pin 1 identifier may be either a
mold, or an embedded metal or marked feature.
Symbol
MIN
Dimension
NOM
(mm)
MAX
A
1.25
-
1.70
A1
0.00
-
0.15
A2
1.25
-
1.70
b
0.31
-
0.51
D
4.80
4.90
5.00
D1
3.30*
-
3.81*
E
5.80
6.00
6.20
E1
3.80
3.90
4.00
E2
2.29*
-
2.79*
e
1.27
BSC
h
0.25
-
0.50
L
0.40
-
1.27
L1
L2
θ
0
O
-
8
O
θ1
5
O
-
15
O
1.04 0.25
REF BSC
JEDEC Registration MS-012, Variation BA, Issue E, Sept. 2005.
Dimensions marked with (*) are non-JEDEC dimensions.
Drawings not to scale.
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
information go to
http://www.supertex.com/packaging.html.)
Doc.# DSFP-CL330
NR110907
7
SUPERTEX [ Supertex, Inc ]
