HV809
8-Lead SOIC (Narrow Body) Package Outline (LG/TG)
4.9x3.9mm body, 1.75mm height (max), 1.27mm pitch
D
8
E
E1
Note 1
(Index Area
D/2 x E1/2)
L
θ1
L2
Gauge
Plane
1
L1
θ
Seating
Plane
Top View
A
Note 1
View B
View B
h
h
A
A2
Seating
Plane
A1
e
b
Side View
A
View A-A
Note 1:
This chamfer feature is optional. If it is not present, then a Pin 1 identifier must be located in the index area indicated.The Pin 1 identifier may be either a
mold, or an embedded metal or marked feature.
Symbol
MIN
Dimension
(mm)
NOM
MAX
A
1.35
-
1.75
A1
0.10
-
0.25
A2
1.25
-
1.50
b
0.31
-
0.51
D
4.80
4.90
5.00
E
5.80
6.00
6.20
E1
3.80
3.90
4.00
e
1.27
BSC
h
0.25
-
0.50
L
0.40
-
1.27
L1
1.04
REF
L2
0.25
BSC
θ
0
O
-
8
O
θ1
5
O
-
15
O
JEDEC Registration MS-012, Variation AA, Issue E, Sept. 2005.
Drawings not to scale.
6
SUPERTEX [ Supertex, Inc ]
