HV853
8-Lead MSOP Package Outline (MG)
3x3mm body, 1.10mm height (max), 0.65mm pitch
D
θ1 (x4)
8
E
E1
Gauge
Plane
L2
Note 1
(Index Area
D1/2 x E1/2)
Seating
Plane
L
θ
1
L1
Top View
View B
A
View B
A2
A
Seating
Plane
b
e
A1
A
View A-A
Side View
Note 1:
A Pin 1 identifier must be located in the index area indicated. The Pin 1 identifier may be either a mold, or an embedded metal or marked feature.
Symbol
A
0.75
-
A1
0.00
-
A2
b
0.22
-
D
E
E1
e
L
L1
L2
θ
0O
-
θ1
5O
-
MIN
NOM
0.75
0.85
0.95
2.80
3.00
3.20
4.65
4.90
5.15
2.80
3.00
3.20
0.40
0.60
0.80
Dimen-
sion
(mm)
0.65
BSC
0.95
REF BSC
0.25
MAX 1.10
0.15
0.38
8O
15O
JEDEC Registration MO-187, Variation AA, Issue E, Dec. 2004.
Drawings not to scale.
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
information go to http://www.supertex.com/packaging.html.)
Doc.# DSFP-HV853
NR051607
7
SUPERTEX [ Supertex, Inc ]
