CERAMIC CHIP INDUCTORS
8. RELIABILITY & TEST CONDITION :
C2 SERIES
ITEM
Solder Heat Resistance
PERFORMANCE
Appearance : Cracks should not be allowed.
More than 75% of the terminal electrode
should be covered with new solder.
TEST CONDITION
Preheat : 100~150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 265±3°C
Flux : Rosin
Dip Time : 6±1sec.
265°C
150°C
Preheating Dipping
Natural
cooling
60
seconds
6±1
seconds
Solderability
More than 90% of the terminal electrode
should be covered with new solder.
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 240±5°C
Flux : Rosin
Dip Time : 3±1sec.
240°C
150°C
Preheating Dipping
Natural
cooling
60
seconds
3±1.0
seconds
Terminal Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
For C Series :
Size
1
2
3
4
5
6
Force (Kfg)
0.2
0.5
0.6
1.0
1.0
1.0
1.5
2.0
> 25
Time (sec)
W
W
7
8
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
20(.787)
Bending
45(1.772)
45(1.772)
40(1.575)
Solder a chip on a test substrate, bend the substrate
by 3mm (0.118in) for 10secs and return.
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.09.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
