MOLDED WIREWOUND CHIP INDUCTORS
9. RELIABILTY TEST :
TERMINAL
STRENGTH-PULL
TEST
TERMINAL SHALL NOT
BE LOOSENED OR
RUPTURED
THE TERMINAL SHALL
SOLDERABILITY TEST
BE AT LEAST 90%
COVERED WITH SOLDER
THERE SHALL BE NO
CASE DEFORMATION
RESISTANCE TO
SOLVENT TEST
CHANGE IN
APPEARANCE OR
OBLITERATION OF
MARKING
CLIMATIC TEST
TEMPERATURE
CHARACTERISTIC
1. INDUCTORS SHALL BE
NO EVIDENCE OF
ELECTRICAL AND
HUMIDITY TEST
MECHANICAL
DAMAGE
2. INDUCTANCE SHALL
COLD TEST
NOT CHANGE MORE
THAN ±10%
3. Q SHALL NOT
CHANGE MORE THAN
THERMAL SHOCK
TEST
±20%
-40°C ----- +125°C
1. TEMP :40±2°C
2. R.H. :90 ----- 95%
3. TIME :96±2 HOURS
1. TEMP :-25±2°C
2. TIME :96±2 HOURS
ROOM TEMP
15 MINS
ROOM TEMP
15 MINS
TOTAL :5 CYCLES
DRY HEAT TEST
HIGH TEMPERATURE
LOAD LIFE TEST
THERE SHALL BE NO
EVIDENCE OF SHORT OR
HUMIDITY LOAD LIFE
OPEN CIRCUITING
1. TEMP :85±2°C
2. TIME :96±2 HOURS
1. TEMP :85±2°C
2. TIME :1000±12 HOURS
HWI322522 SERIES
A 0.5KG LOAD SHALL BE APPLIED TO BOTH
TERMINALS IN THE AXIS DIRECTION FOR
1 MINUTE.
AFTER FLUXING, INDUCTOR SHALL BE DIPPED IN
A MELTED SOLDER BATH AT 240±5°C FOR
5 SECONDS.
MIL-STD-202F, METHOD 215D
-40±2°C
30 MINS
+125±2°C
30 MINS
3. LOAD :ALLOWED DC CURRENT
1. TEMP :40±2°C
2. R.H. :90 ----- 95%
3. TIME :1000±12 HOURS
4. LOAD :ALLOWED DC CURRENT
Note :
Unless otherwise specified, allow the specimen to stand at room temperature for 1 hour
or more but more than 2 hours, measure the electrical and mechanical performances
NOTE : Specifications subject to change without notice. Please check our website for latest information.
26.02.2009
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
