L1M-1N6S-10 参数 Datasheet PDF下载

High Frequency Chip Inductor

L1M SERIES

8-3. Solder Volume

Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume

may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.

Minimum fillet height = soldering thickness + 25% product height

Upper limit

Recommendable

t

Figure 4

NOTE : Specifications subject to change without notice. Please check our website for latest information.

10.11.2011

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 8