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L1M-1N2S-10 参数 Datasheet PDF下载

L1M-1N2S-10图片预览
型号: L1M-1N2S-10
PDF下载: 下载PDF文件 查看货源
内容描述: 高频片式电感 [High Frequency Chip Inductor]
分类和应用:
文件页数/大小: 10 页 / 354 K
品牌: SUPERWORLD [ SUPERWORLD ELECTRONICS ]
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High Frequency Chip Inductor
7. RELIABILITY & TEST CONDITION :
L1M SERIES
ITEM
Electrical Characteristics Test
Inductance (Ls)
Q Factor
DC Resistance
Rated Current
PERFORMANCE
Refer to standard electrical characteristics list
Agilent E4991
Agilent4287
Agilent16192
Agilent 4338
DC Power Supply
TEST CONDITION
Over Rated Current requirements, there will be some risk
Temperature Rise Test
Rated Current < 1A
ΔT
20°C Max
Rated Current
1A
ΔT
40°C Max
No mechanical damage.
Remaining terminal electrode : 75% min.
Preheating
260° C
Dipping
Natural
cooling
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Preheat : 150° C, 60sec.
Solder : Sn-Cu0.5
Solder Temperature : 260± 5° C
Flux for lead free: ROL0
Dip Time : 10± 0.5sec.
Solder Heat Resistance
150° C
60
seconds
10± 0.5
seconds
Solderability
More than 95% of the terminal electrode
should be covered with solder.
Preheating
245° C
Dipping
Natural
cooling
Preheat : 150° C, 60sec.
Solder : Sn-Cu0.5
Solder Temperature : 245± 5° C
Flux for lead free: ROL0
Dip Time : 4± 1sec.
150° C
60
seconds
4± 1.0
seconds
Terminal Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
For L Series :
Size
1
2
3
4
5
6
7
Force (Kfg)
0.2
0.5
0.6
1.0
1.0
1.0
1.5
> 30
Time (sec)
W
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
20(.787)
Bending
45(1.772)
45(1.772)
40(1.575)
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
The duration of the applied forces shall be 60
(+ 5) Sec.
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
10.11.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5