FERRITE CHIP INDUCTORS
8. RELIABILITY & TEST CONDITION :
L2 SERIES
TEST CONDITION
HP4291A, HP4287A+16092A
HP4338B
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
ITEM
Electrical Characteristics Test
Impedance
DC Resistance
Rated Current
Temperature Rise Test
Solder Heat Resistance
PERFORMANCE
Refer to standard electrical characteristics list
30°C max. ( t)
No mechanical damage
Remaining terminal electrode : 70% min.
Preheating Dipping
260°C
150°C
Natural
cooling
60
seconds
10±0.5
seconds
Solderability
More than 90% of the terminal electrode
should be covered with solder.
Preheating Dipping
245°C
150°C
Natural
cooling
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 245±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
60
seconds
4±1.0
seconds
Terminal Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
For Z / L Series :
Size
1
2
3
4
5
6
Force (Kfg)
0.2
0.5
0.6
1.0
1.0
1.0
1.5
2.0
> 25
Time (sec)
W
W
7
8
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
20(.787)
Bending
45(1.772)
45(1.772)
40(1.575)
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
03.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
