FERRITE CHIP INDUCTORS
7. RELIABILITY & TEST CONDITION :
L201610 SERIES
TEST CONDITION
Long storage conditions, please see the aplication notice
HP4291, HP E4991+HP4287 +HP16192
HP4338
DC Power Supply, over rated current ,there will be some risk
ITEM
Operating Temperature
Storage Temperature
Inductance
DC Resistance
Rated Current
Temperature Rise Test
Solder Heat Resistance
-40~+105°C
PERFORMANCE
-40~+105°C (Including self-temperature rise)
Refer to standard electrical characteristics list
40°C max. ( t)
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Preheat : 150°C, 60sec.
Solder : Sn-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : ROL0
Dip Time : 10±0.5sec.
No mechanical damage
Remaining terminal electrode : 75% min.
Appearance: No significant abnormality.
Inductance change: Within ± 10%.
Preheating Dipping
260°C
150°C
Natural
cooling
60
seconds
10±0.5
seconds
Solderability
More than 95% of the terminal electrode
should be covered with solder.
Preheating Dipping
245°C
150°C
Natural
cooling
Preheat : 150°C, 60sec.
Solder : Sn-Cu0.5
Solder Temperature : 245±5°C
Flux for lead free : ROL0
Dip Time : 4±1sec.
60
seconds
4¡À1.0
seconds
Terminal Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
Size
L201610
Force (Kfg)
1.0
Time (sec)
> 30
W
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
20(.787)
Bending
45(1.772)
45(1.772)
40(1.575)
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
The duration of the applied forces shall be 60(+5) Sec
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
13.10.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3