MOLDED POWER CHOKE COIL
9. SOLDERING AND MOUNTING :
9-1. Recommended PC Board Pattern
6.2
2.2
2.8
PIC0518HP SERIES
9-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations.
In the event that a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150° C.
b) 355° C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 4-5 secs.
Preheating
Soldering
20~40s
TEMPERATURE ° C
TEMPERATURE ° C
Natural
cooling
Preheating
350
Soldering
Natural
cooling
TP(260° C/40s max.)
217
200
150
60~180s
25
480s max.
60~150s
150
Time(sec.)
Over 1min.
Gradual
Cooling
Within 4-5s
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
Halogen
Free
HF
NOTE : Specifications subject to change without notice. Please check our website for latest information.
25.02.2011
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
