WIREWOUND CHIP INDUCTORS
SCI1008S SERIES
Mechanical Performance Test :
ITEM
SPECIFICATION
TEST CONDITIONS / TEST METHODS
Appearance : No damage
L change : within ±5%
Q change : within ±10%
Test device shall be soldered on the substrate
Oscillation Frequency : 10 to 55 to 10Hz for 1 min.
Amplitude : 1.5mm
1
2
Vibration
Time : 2hrs for each axis (X, Y, Z), total 6hrs.
Appearance : No damage
L change : within ±5%
Q change : within ±10%
Pre-heating : 150°C, 1 min
Solder Composition : Sn/Pb=63/67
Solder Temperature : 230±5°C
Immersion Time : 20±2sec
Solder Temperature : 260±5°C
Immersion Time : 5±2sec
Resistance to
Soldering Heat
1 lbs. For 0402
2 lbs. For 0603
3 lbs. For the rest
The device should be REFLOW soldered (230±5°C for
10 seconds) to a tinned copper subs rate. A dynamiter
force gauge should be applied to the side of the
conponent. The device must withstand a minimum force
of 2 or 4 pounds without a failure of the termination
attached to component.
3
Component
Adhesion
(Push Test)
The electrodes shall be at
least 90% covered with new
solder coating.
Pre-heating : 150°C, 1min
3
4
Component
Adhesion
(Push Test)
Solder Composition : Sn/Pb=63/67
Solder Temperature : 230±5°C
Immersion Time : 4±1sec
After test, the chip inductor
don't fell of broke on the
P.C.Board
Drop 1 time for each face and 1 time for each corner.
Total drop 10 times.
Drop Test
Drop Height : 100cm
Drop Weight : 125g
The terminal should at least
be 90% covered with solder
after fluxing (alpha 100 or equiv), inductor shall be
5
6
Solderability Test
dipped in a melted solder bath at 232±5°C for 5 seconds.
There shall be no case of
deformation change in
appearance of obliteration
of marking
MIL-STD202F, METHOD 215D
Resistance to
solvent test
NOTE : Specifications subject to change without notice. Please check our website for latest information.
22.06.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
