WIREWOUND CHIP INDUCTORS
SCI1008LP SERIES
Mechanical Performance Test :
ITEM
1
Vibration
SPECIFICATION
Appearance : No damage
L change : within ± 5%
Q change : within ± 10%
TEST CONDITIONS / TEST METHODS
Test device shall be soldered on the substrate
Oscillation Frequency : 10 to 55 to 10Hz for 1 min.
Amplitude : 1.5mm
Time : 2hrs for each axis (X, Y, Z), total 6hrs.
2
Resistance to
Soldering Heat
Appearance : No damage
L change : within ± 5%
Q change : within ± 10%
Pre-heating : 150° C, 1 min
Solder Composition : Sn/Pb=63/67
Solder Temperature : 230± 5° C
Immersion Time : 20± 2sec
Solder Temperature : 260± 5° C
Immersion Time : 5± 2sec
3
Component
Adhesion
(Push Test)
1 lbs. For 0402
2 lbs. For 0603
3 lbs. For the rest
The device should be REFLOW soldered (230± 5° C for
10 seconds) to a tinned copper subs rate. A dynamiter
force gauge should be applied to the side of the
conponent. The device must withstand a minimum force
of 2 or 4 pounds without a failure of the termination
attached to component.
3
Component
Adhesion
(Push Test)
The electrodes shall be at
least 90% covered with new
solder coating.
Pre-heating : 150° C, 1min
Solder Composition : Sn/Pb=63/67
Solder Temperature : 230± 5° C
Immersion Time : 4± 1sec
4
Drop Test
After test, the chip inductor
don't fell of broke on the
P.C.Board
Drop 1 time for each face and 1 time for each corner.
Total drop 10 times.
Drop Height : 100cm
Drop Weight : 125g
5
Solderability Test
The terminal should at least
be 90% covered with solder
after fluxing (alpha 100 or equiv), inductor shall be
dipped in a melted solder bath at 232± 5° C for 5 seconds.
6
Resistance to
solvent test
There shall be no case of
deformation change in
appearance of obliteration
of marking
MIL-STD202F, METHOD 215D
NOTE : Specifications subject to change without notice. Please check our website for latest information.
22.06.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
SUPERWORLD [ SUPERWORLD ELECTRONICS ]
