Surface mount zener diode
FEATURES
Planar die construction.
500mW power dissipation on ceramic
PCB.
General purpose, medium current.
BZT52C2V4-BZT52C51
Pb
Lead-free
Ideally suited for automated assembly processes.
APPLICATIONS
Zener diode.
Ultra-small surface mount package.
SOD-123
ORDERING INFORMATION
Type No.
BZT52C2V4-BZT52C51
Marking
See table 2
Package Code
SOD-123
MAXIMUM RATING
@ Ta=25℃ unless otherwise specified
Characteristic
Forward Voltage
Power Dissipation
Thermal resistance,junction to ambient air
Junction temperature
Storage temperature range
@ I
F
=10mA
Symbol
V
F
P
d
R
θjA
T
j
T
stg
Value
0.9
500
305
150
-65-150
Unit
V
mW
℃/W
℃
℃
Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm
2
2. Short duration test pulse used to minimize self-heating effect.
3. When provided, otherwise, parts are provided with date code only, and type number
identifications appears on reel only.
4. f = 1KHz
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