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CBMF3225T100MR 参数 Datasheet PDF下载

CBMF3225T100MR图片预览
型号: CBMF3225T100MR
PDF下载: 下载PDF文件 查看货源
内容描述: 绕线型片状电感器( CB系列) [WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES)]
分类和应用: 电感器功率感应器
文件页数/大小: 11 页 / 274 K
品牌: TAIYO-YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
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PRECAUTIONS
LEM Type,LB Type,CB Type
1.
Circuit Design
◆Operating
environment
1.The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems,
measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high
Precautions
reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product
failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2.
PCB Design
◆Land
pattern design
Precautions
1.
Please contact any of our offices for a land pattern, and refer to a recommended land pattern of a right figure or specifications.
PRECAUTIONS
Technical
【Recommended
Land Patterns】
consider-
Surface Mounting
ations
Mounting and soldering conditions should be checked beforehand.
Applicable soldering process to those products is reflow soldering only.
3.
Considerations for automatic placement
◆Adjustment
of mounting machine
Precautions
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
Technical
consider- 1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
ations
4.
Soldering
◆Wave
soldering
(LEM
Type only)
1.
For wave soldering,please apply conditions meeting the range of the specifed conditions in our catalog or the relevant specifications.
◆Reflow
soldering
(LB
and CB Types)
1.
For reflow soldering with either leaded or lead-free solder,the profile specified in "point for controlling" is recommended.
(LEM)
Precautions
◆Reflow
soldering
1.
For reflow soldering, please apply conditions meeting the range of the specified conditions in our catalog or the relevant specifications.
◆Recommended
conditions for using a soldering iron
1.
Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350℃ Duration-3 seconds or less. The soldering iron shoud not come in contact
with inductor directly.
◆Wave
soldering
(LEM
Type only)
1.
Components can be damaged by excessive heat where soldering conditions exceed the specified range.
◆Reflow
soldering
(LB
and CB Types)
1.
Reflow profile
300
250
Peak Temp: 260+0/ー5℃
5 sec Max
Pre-heat zone
230℃ Minn
Technical
consider-
ations
200
180℃
150 150℃
100
50
0
90±30 sec
30±10 sec
◆Recommended
conditions for using a soldering iron
1.
Components can be damaged by excessive heat where soldering conditions exceed the specified range.
5.
Cleaning
Precautions
Technical
consider-
ations
6.
Handling
◆Handling
1.
There is a case that a characteristic varies with magnetic influence.
◆Breakaway
PC boards
(splitting
along perforations)
Precautions
1.
Planning pattern configurations and the position of products should be carefully performed to minimize stress.
◆Mechanical
considerations
1.
There is a case to be damaged by a mechanical shock.
◆Handling
1.
Keep the inductors away from all magnets and magnetic objects.
(splitting
along perforations)
Technical
◆Breakaway
PC boards
1.
When splitting the PC board after mounting inductors, care should be taken not to give any stresses of deflection or twisting to the board.
consider-
2.
Board separation should not be done manually, but by using the appropriate devices.
ations
◆Mechanical
considerations
1.
Please do not give the inductors any excessive mechanical shocks.
7.
Storage conditions
◆Storage
Precautions
1.
Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of
taping/packaging materials may take place.
◆Storage
1. maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled.
To
 ・Recommended
conditions
Technical
  Ambient
temperature:0½40℃ / Humidity:Below 70% RH
consider-
The ambient temperature must be kept below 30℃ even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For
ations
this reason, LE type inductors should be used within one year from the time of delivery.
LB type:Should be used within 6 months from the time of delivery.
LE type:In case of storage over 6 months, solderability shall be checked before actual usage.
◆Cleaning
conditions
Washing by supersonic waves shall be avoided.
◆Cleaning
conditions
If washed by supersonic waves, the products might be broken.
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
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